Altek® H864-M SeriesIsophthalic Modified Low Profile Laminating Resin
AOC's Altek H864-M is a medium reactive, resilient, thixotropic, pre-promoted resin.
Fast laminate cure rate allows for faster production rates without loss of surface profile.
Reduced post cure. Fast and complete fiber wet-out.
Good resistance to osmotic blistering (for improved blister resistance, a skin coat made with Hydropel H034-A can be used).
Will provide good physical properties in finished part. Adaptable to a variety of manufacturing processes and conditions.
Meets requirements for low styrene resins in the marine industry.
- Hand lay-up/spray-up
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