Altek® H864-M Series
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Altek® H864-M Series

Isophthalic Modified Low Profile Laminating Resin

Product description

AOC's Altek H864-M is a medium reactive, resilient, thixotropic, pre-promoted resin.


Key benefits

  • Fast laminate cure rate allows for faster production rates without loss of surface profile.

  • Reduced post cure. Fast and complete fiber wet-out.

  • Good resistance to osmotic blistering (for improved blister resistance, a skin coat made with Hydropel H034-A can be used).

  • Will provide good physical properties in finished part. Adaptable to a variety of manufacturing processes and conditions.

  • Meets requirements for low styrene resins in the marine industry.

Processing methods

  • Hand lay-up/spray-up

Key markets

  • Marine

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